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Analysis and design of via loaded microstrip antennas

Başlık çevirisi mevcut değil.

  1. Tez No: 401225
  2. Yazar: OSMAN KANLIOĞLU
  3. Danışmanlar: PROF. DAVID R. JACKSON, DR. JEFFERY T. WILLIAMS
  4. Tez Türü: Doktora
  5. Konular: Elektrik ve Elektronik Mühendisliği, Electrical and Electronics Engineering
  6. Anahtar Kelimeler: Belirtilmemiş.
  7. Yıl: 2007
  8. Dil: İngilizce
  9. Üniversite: Unıversıty Of Houston
  10. Enstitü: Yurtdışı Enstitü
  11. Ana Bilim Dalı: Belirtilmemiş.
  12. Bilim Dalı: Belirtilmemiş.
  13. Sayfa Sayısı: Belirtilmemiş.

Özet

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Özet (Çeviri)

Various planar antenna geometries are encountered that include a circular array of conducting vias (metallic posts). Examples include shorted-annular-ring reduced-surfacewave (SAR-RSW) microstrip antennas, dual-band UHF antennas, and miniaturized microstrip antennas. An accurate analysis of such geometries is thus important. This dissertation presents an electromagnetic investigation of a circular array of vias. The reflection coefficient of a cylindrical wave impinging on a circular array of vias is found analytically. For validation, an equivalent strip model is introduced as a second method to calculate the reflection coefficient of the via array. Equivalent sheet and surface impedance models of the via array are found in terms of the reflection coefficient. A loss calculation for a via array is also introduced and an equivalent sheet resistance of the via array is found. Numerical calculations are presented for the reflection coefficients, as well as the sheet and surface impedances, for several via arrays with different geometries. The change in these quantities is observed by varying the number of vias, the radius of the vias, the radius of the via array, and the dielectric of the medium. These calculations are repeated for the strip model and very good agreement is obtained between the two models, demonstrating the validity and accuracy of the via array analysis. To further validate the via analysis, cavities are created that contain an array of vias. These cavities are simulated with the full-wave electromagnetic simulation software Ansoft HFSS in order to obtain numerically exact values for the resonance frequency and the surface impedance of the via array. These quantities are compared with the corresponding analytical values based on the via array analysis, and very good agreement is obtained. Finally, the utilization of via arrays in practical antenna design is demonstrated. An SARRSW antenna for GPS is designed using a surface impedance wall realized by a circular array of vias. A UHF dual-band microstrip antenna design is also presented that uses a circular via array to realize dual-band performance. A miniaturized circular microstrip antenna with a monopole-like pattern is also designed using a circular array of vias.

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